Datasheet
Technical PPT
Products

Spatium Spatially Combined Power Amplifiers

CAP Wireless Spatium power amplifiers incorporate an exclusive, patented (#7,215,212) spatial combining technology that offers substantially broader bandwidth than competitive products. In addition, a unique circuit topology used in conjunction with commercially available microwave monolithic integrated circuits (MMICs) enables a highly manufacturable platform. The topology leverages component commonality between different models, eliminating time-consuming redesigns for each variation and increasing repeatability unit-to-unit, resulting in significant time-to-manufacture cost-savings for customers.

The CAP technology was originally developed in response to demand for an amplifier architecture that could provide, in a compact package, the reliability and ruggedness associated with solid-state power amplifiers (SSPAs) and the signature low thermal-noise characteristic of solid-state performance, and could also support moderate to high power levels and operate linearly with minimal harmonic and intermodulation distortion over very broad frequency ranges —all at a competitive price.

CAP’s Spatium products efficiently combine large numbers of amplifiers with inherently low loss structure, graceful degradation on failure, low-voltage operation, solid-state reliability, and good phase noise characteristics. The technology is well-suited for both defense and commercial broadband power amplifier applications such as electronic counter measures (ECM), laboratory instrumentation, and electromagnetic compatibility/electromagnetic interference (EMC/EMI) test, as well as narrower band applications like radar, microwave imaging, and satellite communications


Key Features


- Exceptionally linear operation
- Highly efficient power combining
- Enhanced thermal pathways
- Low voltage operation for greater safety and reliability
- Longer life
- Low thermal noise characteristics for improved signal-to-noise ratios